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ISO 26262 Semiconductor Development Audit Checklist

A detailed checklist for auditing compliance with ISO 26262 Part 11 requirements in automotive semiconductor development, focusing on safety-critical aspects of chip design and integration

ISO 26262 Semiconductor Development Audit Checklist
by: audit-now
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About This Checklist

The ISO 26262 Semiconductor Development Audit Checklist is a crucial tool for ensuring the safety and reliability of automotive-grade semiconductors. This comprehensive checklist addresses the specific requirements outlined in Part 11 of the ISO 26262 standard, which focuses on guidelines for application of ISO 26262 to semiconductors. By meticulously evaluating semiconductor design processes, failure mode analysis, and safety mechanisms at the chip level, this checklist assists semiconductor designers, automotive electronics engineers, and quality assurance teams in identifying potential vulnerabilities, ensuring robust chip designs, and maintaining compliance with stringent automotive safety standards. Implementing this checklist not only enhances the overall quality of automotive semiconductors but also contributes to the development of safer, more reliable vehicles by minimizing the risk of chip-level failures in safety-critical systems.

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Industry

Automotive

Standard

ISO 26262

Workspaces

Semiconductor design centers
Automotive electronics laboratories
Chip testing and qualification facilities

Occupations

Semiconductor Designer
Automotive Electronics Engineer
Functional Safety Manager
Quality Assurance Specialist
Integrated Circuit (IC) Development Engineer

Automotive Semiconductor Safety Audit

(0 / 6)

1
Provide details on the semiconductor qualification process.

Please enter details regarding the semiconductor qualification process.

To gather comprehensive information on the qualification to meet automotive standards.
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2
Has process variation been considered in the design?

Indicate whether process variation considerations are included.

To ensure that the design accounts for variations in semiconductor manufacturing.
3
Are on-chip diagnostics implemented in the design?

Select the implementation status of on-chip diagnostics.

To determine if the design includes mechanisms for self-diagnosis.
4
How many soft error mitigation techniques are implemented?

Enter the number of techniques implemented.

To assess the robustness of the design against soft errors.
Min: 0
Target: 0
Max: 10
5
What safety analysis method was used (e.g., FMEDA, FMEA)?

Please specify the safety analysis method used.

To verify that appropriate safety analysis methodologies were applied.
6
Is the semiconductor design compliant with ISO 26262 Part 11?

Select the compliance status.

To ensure adherence to safety standards in automotive semiconductor development.
7
Provide notes from the post-integration review.

Please enter notes from the post-integration review.

To capture insights and lessons learned from the integration process.
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8
Is the integration documentation complete and up to date?

Indicate whether the documentation is complete.

To ensure that all necessary documentation is available for reference.
9
What is the assessed failure rate for the integrated chip?

Select the failure rate assessment.

To quantify the reliability of the integrated chip based on failure rates.
10
What percentage of tests were performed on the integrated chip?

Enter the percentage of test coverage.

To evaluate the thoroughness of testing conducted on the chip integration.
Min: 0
Target: 100
Max: 100
11
What challenges were faced during chip integration?

Please describe any challenges encountered during integration.

To identify potential issues and improve future integration processes.
12
Is the chip integration compliant with automotive standards?

Select the compliance status.

To ensure that the integration of chips meets industry compliance for automotive applications.
13
Provide details on risk mitigation strategies employed.

Please enter details regarding risk mitigation strategies.

To understand how potential risks have been addressed in the design.
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14
Has compliance testing been conducted on the chip?

Indicate whether compliance testing was performed.

To confirm that the chip has undergone testing for compliance with safety standards.
15
What level of diagnostic coverage is implemented?

Select the diagnostic coverage level.

To assess the effectiveness of the diagnostics in the chip design.
16
How many fail-safe mechanisms are incorporated in the chip design?

Enter the number of fail-safe mechanisms.

To evaluate the redundancy and safety features of the design.
Min: 0
Target: 2
Max: 10
17
What hazard analysis methodology was applied?

Please specify the hazard analysis methodology used.

To verify that appropriate methods were used for hazard identification and assessment.
18
Is there proper documentation of safety requirements for the chip?

Select the documentation status.

To ensure that all safety requirements are formally documented and accessible.
19
Provide a summary of the safety assessment conducted.

Please enter the safety assessment summary.

To gather insights and conclusions from the safety assessment process.
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20
Has a third-party safety review been conducted?

Indicate whether a third-party safety review was performed.

To ensure an independent evaluation of safety has taken place.
21
Have validation tests for safety been conducted?

Select whether safety validation tests were conducted.

To confirm that safety validation testing is performed as part of the design process.
22
What is the Safety Integrity Level (SIL) assigned to the chip?

Enter the assigned Safety Integrity Level (SIL) number.

To assess the level of safety integrity required for the chip functionality.
Min: 1
Target: 3
Max: 4
23
What are the defined safety goals for the chip design?

Please describe the safety goals defined.

To verify that clear safety goals are established for the chip.
24
Has a functional safety analysis been completed for the chip?

Select the status of the functional safety analysis.

To ensure that all functional safety aspects have been thoroughly analyzed.
25
Provide details on any issues identified during the verification process.

Please enter details regarding issues identified during verification.

To document any problems encountered and ensure they are addressed.
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26
Have the results of the tests been reviewed?

Indicate whether the test results have been reviewed.

To ensure that test results are adequately assessed for compliance.
27
What is the status of the test execution for the chip?

Select the current status of test execution.

To understand the progress of the verification testing.
28
How many test cases were developed for the chip verification?

Enter the number of test cases developed.

To assess the comprehensiveness of the verification process.
Min: 0
Target: 50
Max: 200
29
What verification methods were utilized during the design?

Please specify the verification methods used.

To determine the effectiveness of the verification methods applied.
30
Is there a design verification plan in place for the chip?

Select the status of the design verification plan.

To ensure that a structured approach to design verification has been established.

FAQs

This checklist specifically addresses Part 11 of ISO 26262, which provides guidelines for the application of ISO 26262 to semiconductor development in automotive systems.

The primary users are semiconductor designers, automotive electronics engineers, functional safety managers, and quality assurance specialists involved in developing and integrating automotive-grade semiconductors.

Semiconductors are critical components in modern automotive systems, and their failure can have significant safety implications. Ensuring their robustness and reliability is crucial for overall vehicle safety.

The checklist covers semiconductor-specific safety requirements, design for safety techniques, failure mode effects and diagnostic analysis (FMEDA) at the chip level, qualification and characterization processes, and integration considerations for automotive applications.

This checklist focuses on semiconductor-specific concerns such as on-chip diagnostics, soft error handling, process variation effects, and specialized qualification methods unique to integrated circuit development for automotive use.

Benefits

Ensures compliance with ISO 26262 Part 11 semiconductor development requirements

Improves reliability and safety of automotive-grade semiconductors

Facilitates early detection of potential chip-level safety issues

Enhances traceability between system-level safety requirements and semiconductor implementations

Supports comprehensive failure mode analysis at the semiconductor level